Title:
PATTERN-FORMING METHOD AND RADIATION-SENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/131953
Kind Code:
A1
Abstract:
The present invention is a pattern-forming method provided with a step for coating the surface of a substrate with a radiation-sensitive composition containing a polymer and a radiation-sensitive acid generator, a step for exposing the coating of the radiation-sensitive composition formed in the coating step to light, and a step for developing the coating of the radiation-sensitive composition exposed to light, the polymer having a first structural unit expressed by formula (1). In formula (1), R1 is a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group. A is a monovalent organic group having a nitrogen atom.
Inventors:
OSAKI HITOSHI (JP)
Application Number:
PCT/JP2018/048341
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/20
Domestic Patent References:
| WO2011108665A1 | 2011-09-09 |
Foreign References:
| JP2002148806A | 2002-05-22 | |||
| JP2008149447A | 2008-07-03 | |||
| JP2014528015A | 2014-10-23 |
Other References:
KIHARA, NAOKO: "Directed Self-Assembly Lithography Technology", TOSHIBA REVIEW, vol. 67, no. 4, 1 April 2012 (2012-04-01), pages 44 - 47, XP055623406
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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