PATTERN FORMING METHOD AND PATTERN SUBSTRATE MANUFACTURING METHOD

WIPO Patent Application WO/2011/125335

A1

Disclosed are a pattern forming method that forms, by an imprint method, a high-resolution pattern that is highly resilient to etching, said pattern forming method being suited to mass production, and a pattern substrate manufacturing method using same. On a substrate (10), a resist layer (20m) (which may include unavoidable impurities) is formed, which is made of a resist composition (20) that includes a polymerizable compound (21) containing polyfunctional monomers that make a polymer having a three-dimensional structure cross-linked by polymerization; and a polymerization initiator (I) that activates by either light or electron beams. An uneven surface of a mold (30), having a prescribed uneven pattern on the surface thereof, is contact pressed upon the resist layer (20m). Light (L1) is projected upon the resist layer (20m), curing the resist layer (20m), and the mold (30) is removed from the resist layer (20m) when the temperature of the resist layer (20m) is greater than or equal to 40 degrees C.

OMATSU, Tadashi (210 Nakanuma, Minamiashigara-sh, Kanagawa 93, 〒2500193, JP)
大松禎 (〒93 神奈川県南足柄市中沼２１０番地富士フイルム株式会社内 Kanagawa, 〒2500193, JP)

JP2011/002087

October 13, 2011

April 08, 2011

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FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
富士フイルム株式会社 (〒20 東京都港区西麻布２丁目２６番３０号 Tokyo, 〒1068620, JP)
OMATSU, Tadashi (210 Nakanuma, Minamiashigara-sh, Kanagawa 93, 〒2500193, JP)

H01L21/027; B29C59/02; C08F2/46

YANAGIDA, Masashi et al. (YANAGIDA & Associates, 7F Shin-Yokohama KS Bldg.,3-18-3, Shin-Yokohama, Kohoku-k, Yokohama-shi Kanagawa 33, 〒2220033, JP)

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