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Title:
PATTERN MEASUREMENT DEVICE AND PATTERN MEASUREMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2019/073592
Kind Code:
A1
Abstract:
The present invention comprises a computation device for measuring the dimensions of patterns formed on a sample on the basis of a signal obtained from a charged particle beam device. The computation device comprises a positional deviation amount calculation unit for calculating the amount of positional deviation, in a direction parallel to a wafer surface, between two patterns at different heights on the basis of an image acquired at a given beam tilt angle; a pattern inclination amount calculation unit for calculating an amount of pattern inclination from the amount of positional deviation using a predetermined relational expression for the amount of positional deviation and the amount of pattern inclination; and a beam tilt control amount calculation unit for controlling the beam tilt angle so as to match the amount of pattern inclination. The pattern measurement device sets the beam tilt angle to a calculated beam tilt angle, reacquires an image, and measures the patterns.

Inventors:
YAMAMOTO TAKUMA (JP)
OHTA HIROYA (JP)
TANIMOTO KENJI (JP)
ABE YUSUKE (JP)
TAMORI TOMOHIRO (JP)
NOJIRI MASAAKI (JP)
Application Number:
PCT/JP2017/037172
Publication Date:
April 18, 2019
Filing Date:
October 13, 2017
Export Citation:
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Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01B15/00; G01N23/225
Domestic Patent References:
WO2014181577A12014-11-13
WO2017179138A12017-10-19
Foreign References:
JP2011077299A2011-04-14
JP2014170751A2014-09-18
JP2015158462A2015-09-03
US20150276375A12015-10-01
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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