Title:
PATTERN MEASURING DEVICE, METHOD, AND PROGRAM, AND PATTERN INSPECTING DEVICE, METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/206144
Kind Code:
A1
Abstract:
Provided is technology for measuring a pattern and inspecting the measured pattern without relying on empirical assumptions by an operator of a pattern inspecting device. This pattern inspecting device for inspecting a plurality of types of pattern formed on a target object is provided with: an input unit for inputting image data of the target object; an external shape extracting unit for extracting the external shapes of the plurality of types of pattern from the image data of the target object; a calculating unit for calculating quantified data relating to the external shape from the extracted external shape; and a comparing unit for comparing the quantified data relating to the external shape with external shape quantified data in a recipe.
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Inventors:
ISHIKAWA AKIO (JP)
Application Number:
PCT/JP2021/014917
Publication Date:
October 14, 2021
Filing Date:
April 08, 2021
Export Citation:
Assignee:
ALITECS CORP (JP)
International Classes:
G01B15/04; G03F7/20; G06T7/00; H01L21/66
Foreign References:
| JP2018017835A | 2018-02-01 | |||
| JP2008182114A | 2008-08-07 |
Attorney, Agent or Firm:
YAHAGI Tetsuo (JP)
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