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Title:
PATTERN PLATE FOR PLATING AND WIRING BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/144959
Kind Code:
A1
Abstract:
This pattern plate for plating is configured so as to transfer a transfer pattern formed by electroless plating to a substrate. The pattern plate for plating is provided with a transfer part which has a transfer surface configured such that a transfer pattern is formed by electroless plating. The transfer surface of the transfer part contains iron and nickel. The pattern plate for plating can form thinner conductive patterns with stable quality.

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Inventors:
NIRENGI TAKAYOSHI
IGUCHI HIDEO
Application Number:
PCT/JP2019/046282
Publication Date:
July 16, 2020
Filing Date:
November 27, 2019
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C25D7/00; C23C18/32; H05K3/18; H05K3/20
Foreign References:
JP2007266316A2007-10-11
JP2005183512A2005-07-07
JPH02159789A1990-06-19
JP2001127409A2001-05-11
JP2007266324A2007-10-11
JPH11274694A1999-10-08
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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