Title:
PATTERN SHAPE ESTIMATION METHOD AND PATTERN MEASURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/021346
Kind Code:
A1
Abstract:
Provided are a pattern shape estimation method and a pattern measuring device which are capable of more appropriately estimating pattern shapes. Under different conditions, multiple pattern cross-sectional shapes are obtained by exposure process simulations. Each of the aforementioned multiple pattern cross-sectional shapes is used to estimate waveforms. The estimation results are stored in a library. The actual waveform obtained during measurement is compared with the estimated waveforms, a selection is made of the estimated waveform that best matches with the actual waveform, and the shape of the measured pattern is estimated.
Inventors:
TANAKA MAKI (JP)
HASEGAWA NORIO (JP)
SHISHIDO CHIE (JP)
OSAKI MAYUKA (JP)
HASEGAWA NORIO (JP)
SHISHIDO CHIE (JP)
OSAKI MAYUKA (JP)
Application Number:
PCT/JP2010/004589
Publication Date:
February 24, 2011
Filing Date:
July 15, 2010
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
TANAKA MAKI (JP)
HASEGAWA NORIO (JP)
SHISHIDO CHIE (JP)
OSAKI MAYUKA (JP)
TANAKA MAKI (JP)
HASEGAWA NORIO (JP)
SHISHIDO CHIE (JP)
OSAKI MAYUKA (JP)
International Classes:
G01B15/04; G01N23/225; H01L21/66
Foreign References:
| JP2003173948A | 2003-06-20 | |||
| JP2007218711A | 2007-08-30 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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