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Patent Searching and Data


Title:
PATTERN SHAPE EVALUATION METHOD AND PATTERN SHAPE EVALUATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/001967
Kind Code:
A1
Abstract:
An image of the joint portion of a circuit pattern manufactured using a design pattern for double patterning is read out, and a target boundary line and an evaluation region are set (701, 711, 721) on the image. In the evaluation region, image processing is performed (702, 712, 722) in the direction of the target boundary line, and furthermore, binarization processing is performed (703, 713, 723). On the basis of the image obtained in such a manner, presence/absence of a pattern defect is determined.

Inventors:
TOYODA Yasutaka (HITACHI LTD., 1-1, Omikacho 7-chome, Hitachi-sh, Ibaraki 92, 〒3191292, JP)
豊田 康隆 (〒92 茨城県日立市大みか町七丁目1番1号 株式会社日立製作所 日立研究所内 Ibaraki, 〒3191292, JP)
Application Number:
JP2010/061039
Publication Date:
January 06, 2011
Filing Date:
June 29, 2010
Export Citation:
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Assignee:
HITACHI HIGH-TECHNOLOGIES CORPORATION (24-14, Nishishimbashi 1-chome Minato-k, Tokyo 17, 〒1058717, JP)
株式会社 日立ハイテクノロジーズ (〒17 東京都港区西新橋一丁目24番14号 Tokyo, 〒1058717, JP)
TOYODA Yasutaka (HITACHI LTD., 1-1, Omikacho 7-chome, Hitachi-sh, Ibaraki 92, 〒3191292, JP)
International Classes:
G01B15/04; G01N23/225; H01L21/66
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, p.c. (Room 331, New Ohtemachi Bldg. 2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
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