Title:
PATTERNED ADHESIVE LAYER, MANUFACTURING METHOD THEREOF, CURABLE COMPOSITION, LAMINATE, AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/065360
Kind Code:
A1
Abstract:
In this patterned adhesive layer, a composition that contains the cured product of a curable composition and that contains, in the same ratio as said curable composition, a component of said curable composition other than the solvent, has fluidity at 25°C and 1 atm, and the surface of said cured product is adhesive at 25°C. Also provided the curable composition which is used in the formation of the aforementioned patterned adhesive layer; a manufacturing method of the patterned adhesive layer; a manufacturing method of a laminate that includes the aforementioned patterned adhesive layer; and a semiconductor element manufacturing method that involves the aforementioned laminate manufacturing method.
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Inventors:
YAMASHITA KOSUKE (JP)
SAIE TOSHIYUKI (JP)
TAKAKUWA HIDEKI (JP)
SHIMADA KAZUTO (JP)
SAIE TOSHIYUKI (JP)
TAKAKUWA HIDEKI (JP)
SHIMADA KAZUTO (JP)
Application Number:
PCT/JP2021/034787
Publication Date:
March 31, 2022
Filing Date:
September 22, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09J4/02; C09J7/38; C09J11/04; C09J201/00; G03F7/004; G03F7/027; G03F7/40; H01L21/60
Foreign References:
| JPH09188863A | 1997-07-22 | |||
| JP2018202634A | 2018-12-27 | |||
| JP2018127621A | 2018-08-16 | |||
| US20120181703A1 | 2012-07-19 | |||
| JP2006117858A | 2006-05-11 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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