Title:
PATTERNED COMPOSITE SUBSTRATE AND LED CHIP THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/273204
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of semiconductors, and relates in particular to a patterned composite substrate and an LED chip thereof. The patterned composite substrate comprises a substrate body and a periodic composite structure protruding from the upper surface of the substrate body; the composite structure comprises a platform and a cone arranged in a stack; the material of the platform is different to the material of the cone; and the base angle α of the cone is smaller than the base angle θ of the platform. The patterned composite substrate of the present disclosure has more light efficiency advantages than other patterned substrates with the same height and bottom diameter, and the brightness of the LED chip is 5-10% higher than conventional conical PSS substrates.
More Like This:
Inventors:
FU XINGXING (CN)
CHENG CHIH-CHING (CN)
LIU PENG (CN)
SUN SHUAI (CN)
SONG CHANGWEI (CN)
LU LING (CN)
CHENG CHIH-CHING (CN)
LIU PENG (CN)
SUN SHUAI (CN)
SONG CHANGWEI (CN)
LU LING (CN)
Application Number:
PCT/CN2021/138504
Publication Date:
January 05, 2023
Filing Date:
December 15, 2021
Export Citation:
Assignee:
HUAIAN AUCKSUN OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H01L33/00; H01L33/20
Foreign References:
| CN215070019U | 2021-12-07 | |||
| CN210403763U | 2020-04-24 | |||
| CN213124474U | 2021-05-04 | |||
| CN108091738A | 2018-05-29 | |||
| CN109786524A | 2019-05-21 | |||
| KR20170123531A | 2017-11-08 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
Download PDF:
Previous Patent: OPTICAL MOS SOLID RELAY
Next Patent: PORTABLE MEAL BOX AND STIR-FRYING DEVICE HAVING SAME
Next Patent: PORTABLE MEAL BOX AND STIR-FRYING DEVICE HAVING SAME