Title:
PATTERNING METHOD AND PATTERNING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/182028
Kind Code:
A1
Abstract:
This patterning method includes a soaking step and an etching step. The soaking step involves soaking a material for increasing a selection ratio of an exposure portion and a non-exposure portion on a photoresist film of a substrate having, on a surface thereof, the photoresist film in which the exposure portion and the non-exposure portion are formed via exposure. The etching step involves dry-etching the photoresist film that has been subjected to the soaking step.
Inventors:
YAMADA KAZUKI (JP)
TSUZUKI REIKO (JP)
YAMAJI TOMOHITO (JP)
TSUZUKI REIKO (JP)
YAMAJI TOMOHITO (JP)
Application Number:
PCT/JP2023/009518
Publication Date:
September 28, 2023
Filing Date:
March 13, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; G03F7/20
Foreign References:
| JPH1172922A | 1999-03-16 | |||
| JP2014175358A | 2014-09-22 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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