PATTERNING SHEET AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2011/108482

A1

By performing injection molding with the disclosed patterning sheet inserted into the injection mold and subsequently detaching the patterning sheet, said patterning sheet can apply a pattern to the surface of an injection-molded object. The disclosed patterning sheet, which is thicker in some parts and thinner in others, is formed by shining infrared light on a heat-shrinkable resin sheet, the surface of which has regions (A and B) that absorb infrared light to different degrees. Also disclosed is a method for manufacturing said patterning sheet. In said method, a heat-shrinkable resin sheet, the surface of which has regions (A and B) that absorb infrared light to different degrees, is held in position while a thickness difference is created between the regions (A and B) by shining infrared light on the sheet such that the surface temperatures of the regions (A and B) differ and the surface temperature of at least one region (A) reaches or exceeds the deorientation strength inflection-point temperature (T) of the resin sheet.

OHYA Satoshi (Central Research Laboratories 631, Sakado, Sakura-sh, Chiba 68, 〒2858668, JP)
大屋　哲 (〒68 千葉県佐倉市坂戸６３１　ＤＩＣ株式会社　総合研究所内 Chiba, 〒2858668, JP)

JP2011/054478

September 09, 2011

February 28, 2011

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DIC Corporation (35-58, Sakashita 3-chome Itabashi-k, Tokyo 20, 〒1748520, JP)
ＤＩＣ株式会社 (〒20 東京都板橋区坂下三丁目３５番５８号 Tokyo, 〒1748520, JP)
OHYA Satoshi (Central Research Laboratories 631, Sakado, Sakura-sh, Chiba 68, 〒2858668, JP)

B29C45/16; B29C45/26; B29C61/06

KONO Michihiro (7-20 Nihonbashi 3-chome, Chuo-k, Tokyo 33, 〒1038233, JP)

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