Pb-FREE SOLDER ALLOY

WIPO Patent Application WO/2012/002147

A1

Disclosed is a Pb-free solder alloy for use under high-temperature conditions, which has strength at a level required for the bonding between an electronic component and a substrate and also has excellent wettablity and processability. Specifically disclosed is a Pb-free solder alloy for use under high-temperature conditions, which comprises 0.4 to 13.5 mass% inclusive of Zn, 0.05 to 2.0 mass% inclusive of Cu, not more than 0.500 mass% of P, and a remainder made up by Bi and unavoidable impurities. The Pb-free solder alloy may additionally contain 0.03 to 0.7 mass% inclusive of Al.

NAGATA Hiroaki (Advanced Materials Div. Sumitomo Metal Mining Co., LTD. 6-1, Suehiro-cho 1-chome, Ome-sh, Tokyo 01, 〒1988601, JP)
永田　浩章 (〒01 東京都青梅市末広町１丁目６番１号　住友金属鉱山株式会社　機能性材料事業部　青梅事業所内 Tokyo, 〒1988601, JP)
ISEKI Takashi (Advanced Materials Div. Sumitomo Metal Mining Co., LTD. 6-1, Suehiro-cho 1-chome, Ome-sh, Tokyo 01, 〒1988601, JP)
井関　隆士 (〒01 東京都青梅市末広町１丁目６番１号　住友金属鉱山株式会社　機能性材料事業部　青梅事業所内 Tokyo, 〒1988601, JP)

JP2011/063658

January 05, 2012

June 15, 2011

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SUMITOMO METAL MINING CO., LTD. (11-3, Shimbashi 5-chome Minato-k, Tokyo 16, 〒1058716, JP)
住友金属鉱山株式会社 (〒16 東京都港区新橋５丁目１１番３号 Tokyo, 〒1058716, JP)
NAGATA Hiroaki (Advanced Materials Div. Sumitomo Metal Mining Co., LTD. 6-1, Suehiro-cho 1-chome, Ome-sh, Tokyo 01, 〒1988601, JP)
永田　浩章 (〒01 東京都青梅市末広町１丁目６番１号　住友金属鉱山株式会社　機能性材料事業部　青梅事業所内 Tokyo, 〒1988601, JP)
ISEKI Takashi (Advanced Materials Div. Sumitomo Metal Mining Co., LTD. 6-1, Suehiro-cho 1-chome, Ome-sh, Tokyo 01, 〒1988601, JP)

B23K35/26; C22C12/00; H05K3/34

TSUJIKAWA Michinori (Taishodo Bldg, 6F14-16, Shiba 5-chom, Minato-ku Tokyo 14, 〒1080014, JP)

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