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Patent Searching and Data


Title:
PCB BOARD, MANUFACTURING METHOD FOR THE PCB BOARD AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/018915
Kind Code:
A1
Abstract:
Disclosed are a PCB board (100), a manufacturing method for the PCB board (100) and a mobile terminal. The PCB board (100) comprises: a board body (1); and a detection wiring (2), wherein the detection wiring (2) is arranged on the board body (1), and the detection wiring (2) is provided with a copper exposure portion, with a heat dissipation layer (3) being laid on the copper exposure portion.

Inventors:
CHEN XINFENG (CN)
Application Number:
PCT/CN2017/078874
Publication Date:
February 01, 2018
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K1/02; H05K3/00
Foreign References:
CN106231781A2016-12-14
CN205029960U2016-02-10
CN103888567A2014-06-25
CN204206718U2015-03-11
CN205179142U2016-04-20
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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