Title:
PCB BOARD, MANUFACTURING METHOD FOR THE PCB BOARD AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/018915
Kind Code:
A1
Abstract:
Disclosed are a PCB board (100), a manufacturing method for the PCB board (100) and a mobile terminal. The PCB board (100) comprises: a board body (1); and a detection wiring (2), wherein the detection wiring (2) is arranged on the board body (1), and the detection wiring (2) is provided with a copper exposure portion, with a heat dissipation layer (3) being laid on the copper exposure portion.
Inventors:
CHEN XINFENG (CN)
Application Number:
PCT/CN2017/078874
Publication Date:
February 01, 2018
Filing Date:
March 30, 2017
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K1/02; H05K3/00
Foreign References:
CN106231781A | 2016-12-14 | |||
CN205029960U | 2016-02-10 | |||
CN103888567A | 2014-06-25 | |||
CN204206718U | 2015-03-11 | |||
CN205179142U | 2016-04-20 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
Download PDF:
Previous Patent: ANTI-SPRAIN SHOCK-ABSORBING BALANCE AIR-CUSHION SHOE
Next Patent: CHARGING SYSTEM, TERMINAL, POWER ADAPTER AND CHARGING LINE
Next Patent: CHARGING SYSTEM, TERMINAL, POWER ADAPTER AND CHARGING LINE