Title:
PCB, METHOD FOR MANUFACTURING SAME, AND MOBILE TERMINAL
Document Type and Number:
WIPO Patent Application WO/2018/018961
Kind Code:
A1
Abstract:
A PCB, a method for manufacturing same, and a mobile terminal. The PCB (100) comprises: multiple conductive layers (1) that are sequentially stacked; and insulating layers (2). An insulating layer is disposed between each two neighboring conductive layers and comprises an insulating matrix (21) and a heat conducting material (22) mixed into the insulating matrix. By mixing a heat conducting material with the insulating matrix, the heat conducting performance of the insulating layer can be significantly improved, so that heat produced by the PCB during working can be transferred out quickly. Thus, the PCB has better heat dissipation performance, so that electronic components and mobile terminals run more reliably. Moreover, the costs for heat dissipation are reduced, and the overall size of the PCB is not increased.
Inventors:
LING XUHENG (CN)
Application Number:
PCT/CN2017/081722
Publication Date:
February 01, 2018
Filing Date:
April 24, 2017
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K1/02; H05K1/03; H05K3/02
Foreign References:
| CN106061105A | 2016-10-26 | |||
| CN102088817A | 2011-06-08 | |||
| CN101545587A | 2009-09-30 | |||
| CN101553082A | 2009-10-07 |
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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