Title:
PCB MODULE HAVING MULTI-SIDED HEAT SINK STRUCTURE AND MULTILAYER PCB ASSEMBLY FOR USE IN SAME
Document Type and Number:
WIPO Patent Application WO/2018/030633
Kind Code:
A1
Abstract:
The present invention relates to a printed circuit board (PCB) module having a multi-sided heat sink structure. An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.
Inventors:
KIM KU YONG (KR)
Application Number:
PCT/KR2017/006536
Publication Date:
February 15, 2018
Filing Date:
June 21, 2017
Export Citation:
Assignee:
MDM INC (KR)
International Classes:
H05K1/03; H05K1/02; H05K5/00; H05K7/20
Foreign References:
| JP2004363183A | 2004-12-24 | |||
| JP2011009522A | 2011-01-13 | |||
| JP2005229092A | 2005-08-25 | |||
| JP2004214429A | 2004-07-29 | |||
| JP2000200977A | 2000-07-18 |
Attorney, Agent or Firm:
KIM, Dong Jin (KR)
Download PDF: