PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

Title:

PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

Document Type and Number:

WIPO Patent Application WO/2021/162454

Kind Code:

A1

Abstract:

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

More Like This:

JPS59123364	[Title of the device] Circuit device
JPH0515416	[Name of device] Surface mount component

Inventors:

JUNG HWAJOONG (KR)
KIM MANHO (KR)
KIM TAEHWAN (KR)
LEE KIHUK (KR)
CHOI YONGHWAN (KR)

Application Number:

PCT/KR2021/001788

Publication Date:

August 19, 2021

Filing Date:

February 10, 2021

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

H05K1/18; H01L23/495; H04N5/225; H05K1/02; H05K1/11

Foreign References:

JP2017060037A	2017-03-23
US20190149707A1	2019-05-16
US20180130750A1	2018-05-10
KR20190019729A	2019-02-27
KR101142347B1	2012-07-06
US20100244171A1	2010-09-30

Other References: