Title:
PELLICLE FRAME, PELLICLE, PELLICLE-EQUIPPED EXPOSURE ORIGINAL PLATE, EXPOSURE METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY BOARD
Document Type and Number:
WIPO Patent Application WO/2021/246187
Kind Code:
A1
Abstract:
Provided are: a frame-shaped pellicle frame 1 having a pellicle frame main body 1a and an insulation layer 1b covering the pellicle frame main body; a pellicle comprising a pellicle film that is provided on the pellicle frame 1 and a top end surface 13 of the pellicle frame with an adhesive or pressure-sensitive adhesive therebetween; a pellicle-equipped exposure original plate; an exposure method; a method for manufacturing a semiconductor; and a method for manufacturing a liquid crystal display board. The pellicle frame can reduce falling of a foreign matter adhered to the surface thereof.
Inventors:
YANASE YU (JP)
Application Number:
PCT/JP2021/019219
Publication Date:
December 09, 2021
Filing Date:
May 20, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
G03F1/64; G03F7/20
Foreign References:
| JP2016191902A | 2016-11-10 | |||
| JP2018194854A | 2018-12-06 | |||
| JP2019070745A | 2019-05-09 | |||
| JP2013097308A | 2013-05-20 | |||
| JPS6057841A | 1985-04-03 |
Other References:
H. MITSUI : "Progress in Japan in Electrical Insulation at High Temperatures", IEEE ELECTRICAL INSULATION MAGAZINE, vol. 12, no. 3, 1 May 1996 (1996-05-01), USA, pages 16 - 27, XP009532808, ISSN: 0883-7554, DOI: 10.1109/57.509921
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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