Title:
PERMEATION BARRIERS FOR FLEXIBLE ELECTRONICS
Document Type and Number:
WIPO Patent Application WO2006014591
Kind Code:
A3
Abstract:
Permeation barriers having a conventionally deposited layer and a layer applied by atomic layer deposition (ALD) are disclosed for use with flexible substrates. The ALD layers serve as decoupling layers to minimize defects in subsequently applied layers and/or as defect healing layers to seal defects in underlying layers.
Inventors:
BERLAND BRIAN S (US)
ARMSTRONG JOSEPH (US)
HOLLINGSWORTH RUSSELL E (US)
SIMPSON LIN J (US)
ARMSTRONG JOSEPH (US)
HOLLINGSWORTH RUSSELL E (US)
SIMPSON LIN J (US)
Application Number:
PCT/US2005/024266
Publication Date:
August 03, 2006
Filing Date:
July 03, 2005
Export Citation:
Assignee:
ITN ENERGY SYSTEMS INC (US)
BERLAND BRIAN S (US)
ARMSTRONG JOSEPH (US)
HOLLINGSWORTH RUSSELL E (US)
SIMPSON LIN J (US)
BERLAND BRIAN S (US)
ARMSTRONG JOSEPH (US)
HOLLINGSWORTH RUSSELL E (US)
SIMPSON LIN J (US)
International Classes:
C23C16/02; C23C16/56
Domestic Patent References:
| WO2004105149A1 | 2004-12-02 | |||
| WO2001089006A1 | 2001-11-22 | |||
| WO2003088334A2 | 2003-10-23 |
Foreign References:
| US20030143319A1 | 2003-07-31 | |||
| US20030129298A1 | 2003-07-10 |
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