Title:
PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/251289
Kind Code:
A1
Abstract:
Provided are an epoxy resin composition that exhibits exceptional low dielectric characteristics, as well as exceptional copper foil peeling strength and interlayer adhesive strength in printed wiring board applications; a phenol resin and an epoxy resin that yield the epoxy resin composition; and methods for producing said resins. A phenol resin that contains a dicyclopenyl group and is represented by general formula (1). R1 each independently represent a C1-8 hydrocarbon group. R2 each independently represent a hydrogen atom or a dicyclopentyl group, at least one thereof being a dicyclopentyl group. i is an integer of 0-2. n represents the number of repeating units, the average value thereof being a number that is 10-10.
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Inventors:
SOH MASAHIRO (JP)
ISHIHARA KAZUO (JP)
YU KIHWAN (KR)
LIM CHEONGRAE (KR)
JEE JOONGHWI (KR)
ISHIHARA KAZUO (JP)
YU KIHWAN (KR)
LIM CHEONGRAE (KR)
JEE JOONGHWI (KR)
Application Number:
PCT/JP2021/021361
Publication Date:
December 16, 2021
Filing Date:
June 04, 2021
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
KUKDO CHEMICAL CO LTD (KR)
KUKDO CHEMICAL CO LTD (KR)
International Classes:
B32B27/00; B32B27/42; C08G59/06; C08G59/20; C08G59/62; C08G61/02; C08J5/24
Domestic Patent References:
| WO2020129724A1 | 2020-06-25 |
Foreign References:
| JPS6399224A | 1988-04-30 | |||
| JPS61123618A | 1986-06-11 | |||
| JP2011168626A | 2011-09-01 | |||
| US20110245431A1 | 2011-10-06 | |||
| JPH05339341A | 1993-12-21 | |||
| JPH04222819A | 1992-08-12 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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