Title:
PHENOL RESIN MOLDING MATERIAL AND PHENOL RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/061793
Kind Code:
A1
Abstract:
Disclosed is a phenol resin molding material which has improved storage stability, kneading stability and moldability before curing, while exhibiting improved heat resistance, dimensional accuracy and dimensional stability after curing.
The phenol resin molding material contains a novolac phenol resin, a polyvinyl acetate-modified novolac phenol resin, and a filler. Silica is contained therein as the filler in an amount of 75-90% by mass relative to the total amount of the phenol resin molding material.
Inventors:
HIRABAYASHI TATSUO (JP)
MIYOSHI MASANORI (JP)
MIYOSHI MASANORI (JP)
Application Number:
PCT/JP2009/069714
Publication Date:
June 03, 2010
Filing Date:
November 20, 2009
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD (JP)
HIRABAYASHI TATSUO (JP)
MIYOSHI MASANORI (JP)
HIRABAYASHI TATSUO (JP)
MIYOSHI MASANORI (JP)
International Classes:
C08L61/14; C08K3/36
Domestic Patent References:
| WO2005040276A1 | 2005-05-06 |
Foreign References:
| JPS6296569A | 1987-05-06 | |||
| JP2008184488A | 2008-08-14 | |||
| JPH1121432A | 1999-01-26 | |||
| JP2003342444A | 2003-12-03 | |||
| JP2008184490A | 2008-08-14 | |||
| JPS6316830A | 1988-01-23 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
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