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Title:
PHENOL RESIN MOLDING MATERIAL AND PHENOL RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2011/052127
Kind Code:
A1
Abstract:
Disclosed is a phenol resin molding material which contains phenol resin, silica and a hardening agent. The phenol resin contains a high molecular weight novolac phenol resin having a weight average molecular weight of 20,000 or greater in terms of polystyrene as determined by gel permeation chromatography (GPC), and a novolac phenol resin modified with polyvinyl acetate. The high molecular weight novolac phenol resin is included at a proportion of 10-40 mass% relative to the total amount of phenol resin; the novolac phenol resin modified with polyvinyl acetate is included at a proportion of 40-80 mass% relative to the total amount of phenol resin; and the silica is included at a proportion of 75-90 mass% relative to the total amount of phenol resin molding material.

Inventors:
HIRABAYASHI TATSUO (JP)
MIYOSHI MASANORI (JP)
SUDA TATSUYA (JP)
Application Number:
PCT/JP2010/005347
Publication Date:
May 05, 2011
Filing Date:
August 31, 2010
Export Citation:
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Assignee:
PANASONIC ELEC WORKS CO LTD (JP)
HIRABAYASHI TATSUO (JP)
MIYOSHI MASANORI (JP)
SUDA TATSUYA (JP)
International Classes:
C08L61/06; C08K3/36; C08L21/00; C08L27/18
Domestic Patent References:
WO2010061793A12010-06-03
WO2005040276A12005-05-06
Foreign References:
JP2008184488A2008-08-14
JP2001122937A2001-05-08
JP2006117815A2006-05-11
JPS61266455A1986-11-26
JP2008184490A2008-08-14
JP2009114463A2009-05-28
JP2000044771A2000-02-15
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
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