Title:
PHENOLIC HYDROXYL GROUP-CONTAINING POLYIMIDE RESIN AND PHOTOSENSITIVE RESIN COMPOSITION USING SAME
Document Type and Number:
WIPO Patent Application WO/2010/044381
Kind Code:
A1
Abstract:
Provided is a resin and a resin composition that are easily synthesized and patterned, and that sufficiently provide characteristics such as flame retardancy, heat resistance, mechanical characteristics, and flexibility. The resin is a phenolic hydroxyl group-containing polyimide resin obtained by condensation polymerization of (a) a tetrabasic acid dianhydride, (b) an aminophenol compound that has at least two amino groups and at least one phenolic hydroxyl group in a molecule, and (c) a diamino compound. In the phenolic hydroxyl group-containing polyimide resin, at least 5 mol% of tetrabasic acid dianhydride (a) is one or more alicyclic tetrabasic acid dianhydrides selected from the group comprising formula (1).
Inventors:
TANAKA Ryutaro (())
田中 竜太朗 (())
田中 竜太朗 (())
Application Number:
JP2009/067664
Publication Date:
April 22, 2010
Filing Date:
October 09, 2009
Export Citation:
Assignee:
NIPPONKAYAKU KABUSHIKIKAISHA (11-2, Fujimi 1-chome Chiyoda-k, Tokyo 72, 〒1028172, JP)
日本化薬株式会社 (〒72 東京都千代田区富士見１丁目１１番２号 Tokyo, 〒1028172, JP)
TANAKA Ryutaro (())
日本化薬株式会社 (〒72 東京都千代田区富士見１丁目１１番２号 Tokyo, 〒1028172, JP)
TANAKA Ryutaro (())
International Classes:
C08G73/10; G03F7/004; G03F7/023; H01L21/027
Attorney, Agent or Firm:
NAITO Teruo (Shin-Ei Patent Firm, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)