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Title:
PHENOLIC HYDROXYL GROUP-CONTAINING RESIN, PRODUCTION METHOD THEREFOR, PHOTOSENSITIVE COMPOSITION, RESIST MATERIAL, COATING FILM, CURABLE COMPOSITION AND CURED PRODUCT THEREOF, AND RESIST UNDERLAYER FILM
Document Type and Number:
WIPO Patent Application WO/2016/006358
Kind Code:
A1
Abstract:
Provided are: a phenolic hydroxyl group-containing resin that has excellent alkali development properties and that makes it possible to achieve high heat resistance in an obtained cured product; a production method for the hydroxyl group-containing resin; a photosensitive composition; a resist material; a coating film; a curable composition and a cured product thereof; and a resist underlayer film. The phenolic hydroxyl group-containing resin is characterized by comprising a compound (A) having a molecular structure represented by structural formula (1) (in the formula, R1 is an alkyl group, an alkoxy group, or an aryl group, R2 is a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, n is an integer of 2 to 15, and when m is 2 or more, the plurality of R1 may be the same or different from each other).

Inventors:
IMADA TOMOYUKI (JP)
KIMOTO SEIJI (JP)
KIDA SHIGENOBU (JP)
Application Number:
PCT/JP2015/065392
Publication Date:
January 14, 2016
Filing Date:
May 28, 2015
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/04; C07C37/20; C07C39/15; C09D161/04; G03F7/11
Foreign References:
JP2010248368A2010-11-04
JP2010248369A2010-11-04
CN103665284A2014-03-26
JP2014227464A2014-12-08
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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