Title:
PHENOLIC HYDROXYL GROUP-CONTAINING RESIN AND RESIST MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/066373
Kind Code:
A1
Abstract:
The purpose of the invention is to provide: a phenolic hydroxyl group-containing resin having excellent heat resistance and alkali developability, and also having excellent crack resistance when formed into a thick film; and a photosensitive composition, a curable composition, and a resist material containing said resin. Provided is a phenolic hydroxyl group-containing resin comprising, as repeating units, a structural section (α) represented by structural formula (1) or (2) (wherein R2 and R3 each independently represent an aliphatic hydrocarbon group, an aromatic ring-containing hydrocarbon group, an alkoxy group, or a halogen atom) and a structural section (β) represented by structural formula (3) (wherein R4 is a hydrogen atom or a C1-7 aliphatic hydrocarbon group, and R5 is a hydrogen atom or a C8-24 aliphatic hydrocarbon group), the phenolic hydroxyl group-containing resin being characterized in that at least one of R2, R3 and R5 present in the resin is a C8-24 aliphatic hydrocarbon group.
Inventors:
IMADA TOMOYUKI (JP)
SATO YUSUKE (JP)
SATO YUSUKE (JP)
Application Number:
PCT/JP2017/034063
Publication Date:
April 12, 2018
Filing Date:
September 21, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G8/30
Domestic Patent References:
| WO2015141427A1 | 2015-09-24 | |||
| WO2016185865A1 | 2016-11-24 | |||
| WO2017094516A1 | 2017-06-08 |
Foreign References:
| JPH09194413A | 1997-07-29 | |||
| JPH02170812A | 1990-07-02 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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