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Patent Searching and Data


Title:
PHENOLIC RESIN COMPOSITION, AND PHENOLIC RESIN CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2015/182640
Kind Code:
A1
Abstract:
 This phenolic resin composition is characterized by containing a novolak phenolic resin, a resorcinol resin, and a curing agent, and by being a solid. The content ratio of the resorcinol resin is preferably 1-100 mass parts with respect to 100 mass parts of the novolak phenolic resin. The content ratio of the curing agent is preferably 5-25 mass parts with respect to a total of 100 mass parts of the novolak phenolic resin and resorcinol resin. The phenolic resin cured product is characterized by being formed by heat curing the phenolic resin composition.

Inventors:
HARADA NAOYUKI (JP)
KUNIMI TAKAO (JP)
Application Number:
PCT/JP2015/065195
Publication Date:
December 03, 2015
Filing Date:
May 27, 2015
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L61/10; C08K5/107; C08K5/3477; C08L61/12
Foreign References:
JP3237841B22001-12-10
JP2010235671A2010-10-21
JP2012246411A2012-12-13
US20060111508A12006-05-25
Other References:
See also references of EP 3150667A4
Attorney, Agent or Firm:
HAYAMI SHINJI (JP)
Shinji Hayami (JP)
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