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Title:
PHENOLIC RESIN COMPOSITION FOR PHOTORESISTS AND PHOTORESIST COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/050047
Kind Code:
A1
Abstract:
A phenolic resin composition for photoresists, which is characterized by containing a novolac type phenolic resin (A) that is represented by general formula (1) and a novolac type phenolic resin (B) that has at least one of an arylene skeleton and a naphthalene skeleton in the structure in such amounts that the mass ratio of the novolac type phenolic resin (A) to the novolac type phenolic resin (B) is 5-95:95-5. (In general formula (1), each R1 represents a hydrogen atom, a linear or branched alkyl group having 1 to 8 (inclusive) carbon atoms, and the plurality of R1 moieties may be the same as or different from each other, provided that at least one of the R1 moieties is a linear or branched alkyl group having 1 to 8 (inclusive) carbon atoms; each p represents a number of 1 to 3 (inclusive) and the plurality of p's may be the same as or different from each other; each q represents a number of 1 to 3 (inclusive) and the plurality of q's may be the same as or different from each other; p and q satisfy (p + q) ≤ 4; and n represents an integer of 0 or more.)

Inventors:
KUROIWA SADAAKI (JP)
Application Number:
PCT/JP2018/033712
Publication Date:
March 14, 2019
Filing Date:
September 11, 2018
Export Citation:
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Assignee:
MEIWA PLASTIC IND LTD (JP)
International Classes:
C08G8/10; G03F7/023
Domestic Patent References:
WO2015190233A12015-12-17
WO2012090965A12012-07-05
Foreign References:
JP2015055876A2015-03-23
JP2015094775A2015-05-18
JP2014059463A2014-04-03
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
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