Title:
PHENOLIC RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT USING SAME, COPPER-CLAD LAMINATE, AND SEMICONDUCTOR SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/178348
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel phenolic resin that, when used as an epoxy resin curing agent, gives a cured product that exhibits excellent characteristics such as thermal resistance, moisture resistance, permittivity, and dielectric dissipation. The present invention additionally address the problem of providing: an epoxy resin composition containing the novel phenolic resin and an epoxy resin; a cured product of the epoxy resin composition; a copper-clad laminate in which the epoxy resin composition is used as a matrix resin; and a semiconductor sealing material that uses the epoxy resin composition. Provided are a phenolic resin that is represented by formula (1), an epoxy resin composition, and a cured product, a copper-clad laminate, and a semiconductor sealing material that use the epoxy resin composition.
Inventors:
YAMADA KIYOMI (JP)
TAKENOUCHI MASATO (JP)
SHINODA KYOUICHI (JP)
SANAI RIE (JP)
KIMURA ERINA (JP)
TAKENOUCHI MASATO (JP)
SHINODA KYOUICHI (JP)
SANAI RIE (JP)
KIMURA ERINA (JP)
Application Number:
PCT/JP2014/061721
Publication Date:
November 06, 2014
Filing Date:
April 25, 2014
Export Citation:
Assignee:
MEIWA PLASTIC IND LTD (JP)
International Classes:
C08G8/04; C08G59/62
Domestic Patent References:
| WO2009119201A1 | 2009-10-01 |
Foreign References:
| JPS60237081A | 1985-11-25 | |||
| JPS6225116A | 1987-02-03 | |||
| JP2001354707A | 2001-12-25 | |||
| JP2003192754A | 2003-07-09 | |||
| JPS5497629A | 1979-08-01 | |||
| JPS57154146A | 1982-09-22 | |||
| JPH05132543A | 1993-05-28 | |||
| JPH11181060A | 1999-07-06 |
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
きさらぎ international patent business corporation (JP)
きさらぎ international patent business corporation (JP)
Download PDF: