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Title:
PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/087973
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin, the cured product of which has excellent heat resistance, solvent-solubility, and stiffness characteristics. This phenolic resin and epoxy resin have a benzopyran structure, and the phenolic resin is represented by formula (1). (In formula (1), R1, R2 and R3 independently represent a hydrogen atom, an alkyl group of 1-6 carbon atoms, an alkyl group of 1-6 carbon atoms, an alkoxy group of 1-6 carbon atoms, a hydroxyl group, an amino group, a nitro group, a nitrile group, an aldehyde group, an acetyl group, a carboxyl group, a sulfo group, a thiol group, a thiol group, a glycidyl group, or a substituted or unsubstituted phenyl group or naphthyl group. Further, k represents an integer 1-3, p an integer 1-4, t an integer 0-4, l an integer 1-10, m an integer 0-10, and n an integer 0-4. The dotted line indicates that there may or may not be a phenyl group.)

Inventors:
HASEGAWA ATSUHIKO (JP)
NAKANISHI MASATAKA (JP)
INOUE KAZUMA (JP)
Application Number:
PCT/JP2014/082852
Publication Date:
June 18, 2015
Filing Date:
December 11, 2014
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G61/12; C08G8/02; C08G59/04; C08G59/62
Domestic Patent References:
WO2012111726A12012-08-23
WO2013111895A12013-08-01
WO2013032190A12013-03-07
Other References:
TOMONORI INAZUMI: "Resorcin-rui to Acetone no Hanno", PROCEEDINGS OF SYMPOSIUM ON NETWORK POLYMER, vol. 44, 20 August 2012 (2012-08-20), pages 105 - 108
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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