PHENOLIC RESIN FOAM BOARD, AND METHOD FOR MANUFACTURING SAME

Title:

PHENOLIC RESIN FOAM BOARD, AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2014/133023

Kind Code:

A1

Abstract:

The present invention provides a phenolic resin foam board, which exhibits sufficient compressive strength and heat conductivity for practical use even when the thickness of the phenolic resin foam board is increased, and which has superior dimensional stability compared with conventional products. The present invention is a phenolic resin foam board which has a board thickness of 40 to 300 mm inclusive. The phenolic resin foam board satisfies the formula 0 ≤ (dave-dmin)/dave ≤ 0.12, where dn represents the density of a nth specimen among n (n ≥ 5) pieces of specimens that are produced by slicing the phenolic resin foam board at almost equal intervals of 8 to 10 mm inclusive in the thickness direction from one main surface of the phenolic resin foam board along the main surface, dave represents the average density of the n pieces of specimens, and dmin represents the lowest density among the densities of the n pieces of specimens. When values for Di = (di+d(i+1))/2 are calculated [where i represents an integer of 1 to (n-1)], the Di values are plotted in the order of the numerical values of i (where the horizontal axis indicates the i values and the vertical axis indicates Di values), and points corresponding to the Di values are connected to produce a density distribution curve, there is no straight line that intersects the density distribution curve at four points and is parallel to the horizontal axis.

Inventors:

KURODA TAKAYUKI (JP)
MIHORI HISASHI (JP)
KITAGAWA TAKATOSHI (JP)

Application Number:

PCT/JP2014/054725

Publication Date:

September 04, 2014

Filing Date:

February 26, 2014

Export Citation:

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Assignee:

ASAHI KASEI CONSTR MAT CO LTD (JP)

International Classes:

C08J9/12

Domestic Patent References:

WO2011074611A1	2011-06-23
WO2012053493A1	2012-04-26
WO2011074611A1	2011-06-23
WO2009066621A1	2009-05-28

Foreign References:

JP2003340846A	2003-12-02
JPH10225993A	1998-08-25
JP2005059370A	2005-03-10
JPH04141406A	1992-05-14
JP5060688B2	2012-10-31
GB882296A	1961-11-15
JPS4017143B
JP5112940B2	2013-01-09
JPH10225993A	1998-08-25

Other References: