PHENOLIC RESIN MIXTURE, AND CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

WIPO Patent Application WO/2022/202333

A1

A phenolic resin mixture comprising (A) a phenolic resin represented by formula (1) or (2) and (B) a crystalline alkyl-substituted biphenol compound having a melting point of 70 to 300°C, in which the ratio of the weight of the component (A) to the weight of the component (B) is 95/5 to 85/15. (In formula (1), a plurality of R1s and ps are present independently, R1s independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituent as mentioned above, ps independently represent a real number of 0 to 3, and n is the number of repeats and represents a real number of 1 to 20.) (In formula (2), a plurality of R1s and ps are present independently, and R1s independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group which may have the same substituent as mentioned above, ps independently represent a real number of 0 to 3, and n is the number of repeats and represents a real number of 1 to 20.)

HASEGAWA ATSUHIKO (JP)
NAKANISHI MASATAKA (JP)
INOUE KAZUMA (JP)

PCT/JP2022/010360

September 29, 2022

March 09, 2022

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NIPPON KAYAKU KK (JP)

C08G59/40

JP2020070303A	2020-05-07
JP2015067615A	2015-04-13
JP2014210860A	2014-11-13
JP2013006328A	2013-01-10

SHIN-EI PATENT FIRM, P.C. (JP)

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