Title:
PHENOLIC RESIN MIXTURE, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/202335
Kind Code:
A1
Abstract:
A phenolic resin mixture including a phenolic resin (A) that is represented by formula (1) or formula (2), and an alkyl-substituted bisphenol compound (B), wherein the weight ratio of component (A) and component (B) is 95/5 to 55/45. (In formula (1), each of the plurality of R1s and ps exists independently, each R1 represents a hydrogen atom, a C1-10 alkyl group, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group that may have the same type of substituent as previously listed, each p is a real number from 0 to 3, and n is the number of repetitions and is a real number from 1 to 20.) (In formula (2), each of the plurality of R1s and ps exists independently, each R1 represents a hydrogen atom, a C1-10 alkyl group, a hydroxyl group, a methoxy group, an ethoxy group, a nitro group, a nitrile group, an amino group, or a phenyl group that may have the same type of substituent as previously listed, each p is a real number from 0 to 3, and n is the number of repetitions and is a real number from 1 to 20.)
Inventors:
HASEGAWA ATSUHIKO (JP)
NAKANISHI MASATAKA (JP)
INOUE KAZUMA (JP)
NAKANISHI MASATAKA (JP)
INOUE KAZUMA (JP)
Application Number:
PCT/JP2022/010370
Publication Date:
September 29, 2022
Filing Date:
March 09, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/40
Foreign References:
| JP2020070303A | 2020-05-07 | |||
| JP2015067615A | 2015-04-13 | |||
| JP2014210860A | 2014-11-13 | |||
| JP2013006328A | 2013-01-10 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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