Title:
PHENOLIC RESIN MIXTURE, EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION, AND CURED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2010/052877
Kind Code:
A1
Abstract:
Disclosed is a phenolic resin mixture which is produced by subjecting a reaction product containing a by-product produced by the halomethylation of a biphenyl to the methylene cross-linking reaction with phenol. Also disclosed is an epoxy resin mixture produced by epoxidizing the phenolic resin mixture. Further disclosed is an epoxy resin composition containing the epoxy resin mixture. A cured product of the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture has excellent flame retardancy, and has a storage modulus that is lower than those of conventional flame-retardant cured epoxy resin products by a value falling within a specific range at 250°C. Therefore, the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture is useful as a semiconductor sealing material that is required to have high flame retardancy and excellent lead-free solder resistance.
Inventors:
SHIRAI KAZUTERU (JP)
OSHIMI KATSUHIKO (JP)
TANAKA EIICHI (JP)
SUNAGA TAKAO (JP)
OSHIMI KATSUHIKO (JP)
TANAKA EIICHI (JP)
SUNAGA TAKAO (JP)
Application Number:
PCT/JP2009/005783
Publication Date:
May 14, 2010
Filing Date:
October 30, 2009
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
SHIRAI KAZUTERU (JP)
OSHIMI KATSUHIKO (JP)
TANAKA EIICHI (JP)
SUNAGA TAKAO (JP)
SHIRAI KAZUTERU (JP)
OSHIMI KATSUHIKO (JP)
TANAKA EIICHI (JP)
SUNAGA TAKAO (JP)
International Classes:
C08G61/02; C08G59/06; C08G59/20
Domestic Patent References:
WO2007063894A1 | 2007-06-07 | |||
WO2006090662A1 | 2006-08-31 |
Foreign References:
JPH08143648A | 1996-06-04 | |||
JPH11130706A | 1999-05-18 | |||
JPH1180047A | 1999-03-23 | |||
JP2001040053A | 2001-02-13 | |||
JPS403774B1 | ||||
JP2001064340A | 2001-03-13 | |||
JP2006124492A | 2006-05-18 |
Attorney, Agent or Firm:
SAEKI, NORIO (JP)
Norio Saeki (JP)
Norio Saeki (JP)
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