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Patent Searching and Data


Title:
PHENOLIC RESIN MOLDING MATERIAL, FRICTION MATERIAL, AND PHENOLIC RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2013/145594
Kind Code:
A1
Abstract:
This phenolic resin molding material contains modified olefin-based polymer particles (I) and a phenolic resin (II). Furthermore, it is preferable for the modified olefin-based polymer particles (I) to satisfy at least one of requirements (A), (B) and (C) below. (A) The modified olefin-based polymer particles (I) contain at least one element selected from among the elements of group 15, group 16 and group 17 of the periodic table. (B) The content of the above elements is 0.05 wt.% to 50 wt.% inclusive relative to a total of 100 wt.% of the modified olefin-based polymer particles (I). (C) The MFR, as measured in accordance with JIS K7210 at a temperature of 190°C and a load of 2.16 kgf, of the modified olefin-based polymer particles (I) is at least 0.001 g/10 min but lower than 3 g/10 min.

Inventors:
ABE TAKAHARU (JP)
MAEDA MASANOBU (JP)
YAMADA TAKAHIRO (JP)
YOSHIDA YASUNORI (JP)
Application Number:
PCT/JP2013/001612
Publication Date:
October 03, 2013
Filing Date:
March 12, 2013
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09K3/14; C08L61/04
Foreign References:
JPS63196648A1988-08-15
JP2003041123A2003-02-13
JP2009536891A2009-10-22
JPS61218663A1986-09-29
JPS60184533A1985-09-20
JPS596246A1984-01-13
JP2006265321A2006-10-05
JPS60163935A1985-08-26
JP2011080013A2011-04-21
JP2005120171A2005-05-12
Other References:
See also references of EP 2832791A4
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
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