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Title:
PHOSPHOR SHEET, LED CHIP USING SAME, LED PACKAGE USING SAME, METHOD FOR PRODUCING LED PACKAGE, AND LIGHT EMITTING DEVICE, BACKLIGHT UNIT AND DISPLAY, EACH OF WHICH COMPRISES SAID LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/155253
Kind Code:
A1
Abstract:
The present invention is able to provide a phosphor sheet which has excellent workability such as cutting workability, while exhibiting good adhesion to an LED chip. The present invention is a phosphor sheet which contains a phosphor and a silicone resin, and which has a storage elastic modulus at 25°C of 0.01 MPa or more, a storage elastic modulus at 100°C of less than 0.01 MPa and a storage elastic modulus G' at 140°C of 0.05 MPa or more.

Inventors:
ISHIDA YUTAKA (JP)
KANZAKI TATSUYA (JP)
NAGASE RYO (JP)
Application Number:
PCT/JP2018/004863
Publication Date:
August 30, 2018
Filing Date:
February 13, 2018
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G02B5/20; C08J5/18; C08K3/10; C08L83/05; C08L83/06; C08L83/07; C09K11/61; C09K11/64; C09K11/66; C09K11/67; H01L33/50
Domestic Patent References:
WO2015093329A12015-06-25
WO2016190283A12016-12-01
Foreign References:
JP2014116587A2014-06-26
JP2014022704A2014-02-03
JP2013001791A2013-01-07
JP2013001792A2013-01-07
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