Title:
PHOTO-CURABLE COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/148148
Kind Code:
A1
Abstract:
[Problem] To obtain a thick molded article readily, at high speed, and with high precision, without requiring a large high-temperature, high-pressure device or a heat-resistant, pressure-resistant mold. [Solution] A photo-curable composition for molds, including a high-molecular compound (A), a reactive diluent (B), and a photopolymerization initiator (C), and characterized by: the high-molecular compound (A) including, as constituent monomer units, a constituent unit comprising a compound indicated by formula (1) and/or a constituent unit comprising a compound indicated by formula (2); the total weight of the compound indicated by formula (1) and/or the compound indicated by formula (2) being at least 60 wt% of the total weight of the high-molecular compound (A); and the reactive diluent (B) including the compound indicated by formula (1) and/or the compound indicated by formula (2).
Inventors:
UTSUNOMIYA SHIN (JP)
Application Number:
PCT/JP2014/053155
Publication Date:
September 25, 2014
Filing Date:
February 12, 2014
Export Citation:
Assignee:
SOKEN KAGAKU KK (JP)
International Classes:
C08F2/44; C08F2/50; G02B1/04; G02C7/00
Foreign References:
| JPH09277700A | 1997-10-28 | |||
| JP2012099638A | 2012-05-24 | |||
| JP2011081126A | 2011-04-21 | |||
| JP2013067711A | 2013-04-18 | |||
| JPH11223704A | 1999-08-17 | |||
| JP2008038117A | 2008-02-21 | |||
| JP3197907B2 | 2001-08-13 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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