Title:
PHOTO-CURABLE COMPOSITIONS FOR ADDITIVE MANUFACTURING
Document Type and Number:
WIPO Patent Application WO/2020/191689
Kind Code:
A1
Abstract:
A photo-curable composition for use in additive manufacturing, said composition comprising, based on the total weight of the composition: from 10 to 80 wt.% of a) a dispersion of nanosilica particles in epoxy resin, said nanosilica particles having an average particle size (d50) of less than 50 nm, as measured by dynamic light scattering; from 10 to 80 wt.% of b) a toughened epoxy resin comprising i) core shell rubber particles; and, ii) at least one cycloaliphatic epoxy resin; and, from 0.1 to 10 wt.% of c) a photoinitatior, said photoinitator comprising an ionic photoacid generator.
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Inventors:
CHEN CHUNFU (JP)
KANARI MASAO (JP)
LI LEO (CN)
LU DAOQIANG (CN)
KANARI MASAO (JP)
LI LEO (CN)
LU DAOQIANG (CN)
Application Number:
PCT/CN2019/080000
Publication Date:
October 01, 2020
Filing Date:
March 28, 2019
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
B33Y80/00; C08G59/68
Domestic Patent References:
WO2017044381A1 | 2017-03-16 |
Foreign References:
JP2002370249A | 2002-12-24 | |||
CN107383253A | 2017-11-24 | |||
CN107513247A | 2017-12-26 | |||
JP2002256062A | 2002-09-11 |
Other References:
See also references of EP 3946946A4
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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