Title:
PHOTO-CURABLE THERMOSETTING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/122027
Kind Code:
A1
Abstract:
Disclosed is a dilute alkali development-type photo-curable thermosetting resin composition which is suitable for use in obtaining a cured coating film which exhibits excellent adhesion with a substrate, chemical resistance, solder heat resistance, PCT resistance, thermal shock resistance, electroless gold plating resistance, electrical insulation properties, etcetera. The disclosed photo-curable thermosetting resin composition is characterised by comprising: a carboxyl group-containing resin, a photosensitive resin having a structure represented by general formulas (1)-(3), and a photopolymerization initiator. (In formula (1) R1 represents the group represented by formula (2), R2 represents a methyl group or an OR1 group, n+m=1.5-6.0, n=0-6.0, m=0-6.0, 1=0-3, and n:m=100:0-0:100.) (In formula (2) R3 represents hydrogen or a methyl group, R4 represents hydrogen or the group represented by formula (3), and k=0.3-10.0) (In formula (3) R5 represents hydrogen or a methyl group.)
Inventors:
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
ONDA SHINJI (JP)
SONE YOSHIHISA (JP)
ARIMA MASAO (JP)
ONDA SHINJI (JP)
SONE YOSHIHISA (JP)
Application Number:
PCT/JP2011/001924
Publication Date:
October 06, 2011
Filing Date:
March 30, 2011
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
AIR WATER INC (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
ONDA SHINJI (JP)
SONE YOSHIHISA (JP)
AIR WATER INC (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
ONDA SHINJI (JP)
SONE YOSHIHISA (JP)
International Classes:
G03F7/038; C08F290/00; G03F7/004; H05K3/28
Foreign References:
| JP2009008921A | 2009-01-15 | |||
| JP2009185182A | 2009-08-20 |
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)
Patent business corporation Amagi international patent firm (JP)
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Claims: