Title:
PHOTO MASK
Document Type and Number:
WIPO Patent Application WO/2020/208848
Kind Code:
A1
Abstract:
Provided is a photomask obtained at low cost and through a straightforward production method, the photomask exhibiting sufficient ESD suppression effects, causing no exposure pattern destruction, and further having suitable exposure efficiency as well as excellent durability and exposure efficiency. This photomask comprises, on the surface of a transparent substrate, a light-blocking film formed into a pattern motif for the purpose of blocking exposure light directed toward the photoresist film. A coating layer comprising a thiophene-based electroconductive resin is formed over the transparent substrate whereon the light blocking film has been formed. On the surface of the photomask having the coating layer comprising the thiophene-based electroconductive resin, the sheet resistance value is a value that is smaller than 1011Ω/□.
Inventors:
ECHIGOYA TAKAHIRO (JP)
IKEDA SHINOBU (JP)
SASAKI MASAHARU (JP)
KATAYAMA YOSHINORI (JP)
IKEDA SHINOBU (JP)
SASAKI MASAHARU (JP)
KATAYAMA YOSHINORI (JP)
Application Number:
PCT/JP2019/042744
Publication Date:
October 15, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
TOPIC CO LTD (JP)
TOPIC CO LTD (JP)
International Classes:
G03F1/40
Foreign References:
| JPS55161240A | 1980-12-15 | |||
| JP2012097274A | 2012-05-24 | |||
| JP2014040549A | 2014-03-06 | |||
| JP2003206454A | 2003-07-22 | |||
| JPH032756A | 1991-01-09 | |||
| JP2018136504A | 2018-08-30 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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