Title:
PHOTO-SENSITIVE RESIN COMPOSITION, CURED FILM, PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREFOR, AND PHOTO-SENSITIVE RESIN COMPOSITION PREPARATION KIT
Document Type and Number:
WIPO Patent Application WO/2019/160126
Kind Code:
A1
Abstract:
This photo-sensitive resin composition comprises: (A1) a polymer that has a carboxyl group but does not have an ethylenic unsaturated group; (A2) a polymer that has a carboxyl group and an ethylenic unsaturated group; (B) a compound that has an ethylenic unsaturated group but does not have a carboxyl group; (C) a thermosetting resin; (D) a metal deactivator; (E) a photopolymerization initiator; and (F) a coloring agent. A cured film can be formed by irradiating a coating film of the photo-sensitive resin composition with an active ray and then thermally curing the coating film by applying a heating treatment thereto.
Inventors:
KIDO MASAYOSHI (JP)
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
ASAHINA YUJI (JP)
KOGISO TETSUYA (JP)
KODA TOMOHIRO (JP)
ASAHINA YUJI (JP)
Application Number:
PCT/JP2019/005720
Publication Date:
August 22, 2019
Filing Date:
February 15, 2019
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
G03F7/004; C08F220/18; G03F7/027; G03F7/033; G03F7/035; H05K3/28
Domestic Patent References:
| WO2017122717A1 | 2017-07-20 |
Foreign References:
| JP2016149388A | 2016-08-18 | |||
| JP2013061639A | 2013-04-04 | |||
| JP2017068247A | 2017-04-06 | |||
| JP2013205552A | 2013-10-07 | |||
| JP2015121653A | 2015-07-02 | |||
| JP2012168473A | 2012-09-06 | |||
| JP2012168472A | 2012-09-06 | |||
| JP2014167510A | 2014-09-11 |
Attorney, Agent or Firm:
SHINTAKU, Masato (JP)
Download PDF: