Title:
PHOTO-THERMAL DUAL-CURING EPOXY RESIN
Document Type and Number:
WIPO Patent Application WO/2022/083024
Kind Code:
A1
Abstract:
According to the present invention, a photo-thermal dual-curing epoxy resin is prepared by one-step reaction of bio-based itaconic acid with an epoxy resin. Epoxy groups are arranged on both ends of the resin, double bonds are arranged on an intermediate main chain, and the resin can simultaneously participate in thermal curing and photocuring reactions. The raw materials of the synthesis reaction are environmentally friendly; a synthesis process is simple, efficient, and suitable for industrial large-scale production; a cured material has high glass transition temperature, high storage modulus, and high strength, and is applicable to the application field of photo-thermal dual-curing, such as coatings, 3D printing, and adhesives.
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Inventors:
LIU REN (CN)
SUN KAIQIANG (CN)
LI XIAOJIE (CN)
SUN KAIQIANG (CN)
LI XIAOJIE (CN)
Application Number:
PCT/CN2021/074149
Publication Date:
April 28, 2022
Filing Date:
January 28, 2021
Export Citation:
Assignee:
UNIV JIANGNAN (CN)
International Classes:
C07C67/24; C08G59/16; C08F220/32
Foreign References:
| CN1425642A | 2003-06-25 | |||
| CN102964968A | 2013-03-13 | |||
| CN102977335A | 2013-03-20 | |||
| CN105061727A | 2015-11-18 | |||
| JP2007153853A | 2007-06-21 | |||
| CN102382079A | 2012-03-21 | |||
| CN102718945A | 2012-10-10 | |||
| JPS63179919A | 1988-07-23 |
Attorney, Agent or Firm:
CHENGGUO INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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