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Title:
PHOTOCATALYTIC MATERIAL AND PHOTOCATALYTIC COATING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/110173
Kind Code:
A1
Abstract:
A photocatalytic material 100 which comprises a base 10 and a photocatalytic layer 20 disposed on one surface of the base. The photocatalytic layer comprises photocatalyst particles 21, copper compound particles 22 comprising copper(II) oxide and/or copper(II) hydroxide, inorganic particles 23 having no photocatalytic activity, and an inorganic binder 24, the amount of the copper contained in the copper compound particles being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles. The copper compound particles have been fixed so as to be in contact with the surfaces of the photocatalyst particles and inorganic particles. The present invention further provides a photocatalytic coating composition which is for forming the photocatalytic layer of said photocatalytic material. The photocatalytic coating composition comprises photocatalyst particles, a copper compound which is a precursor of copper(II) oxide and copper(II) hydroxide and which comprises a compound of a divalent copper ion, inorganic particles having no photocatalytic activity, and a precursor of an inorganic binder, the amount of the copper contained in the copper compound being 0.1-5 parts by mass per 100 parts by mass of the photocatalyst particles.

Inventors:
KATO DAIKI
MIKI SHINICHIRO
Application Number:
PCT/JP2017/040590
Publication Date:
June 21, 2018
Filing Date:
November 10, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C09D201/00; B01J23/72; B01J35/02; B32B9/00; C09D1/00; C09D5/16
Domestic Patent References:
WO2014184989A12014-11-20
Foreign References:
JP2002212510A2002-07-31
JPH09227829A1997-09-02
JP2011063973A2011-03-31
JP2013124312A2013-06-24
JP2016112480A2016-06-23
JPH11169727A1999-06-29
JP2013166705A2013-08-29
JP2015205998A2015-11-19
JP2010149099A2010-07-08
JP2011050847A2011-03-17
Attorney, Agent or Firm:
ITO Masakazu et al. (JP)
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