Title:
PHOTOCURABLE ADHESIVE COMPOSITION AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/139055
Kind Code:
A1
Abstract:
The present invention provides a photocurable adhesive composition that has excellent heat resistance (flocculating property) without leaving an adhesive residue on adherends even when heat treatment is performed, and also makes it possible to obtain an adhesive sheet excellent in storability during storage. The photocurable adhesive composition of the present invention comprises a (meth)acrylic polymer and a photopolymerization initiator, and after a photocurable adhesive layer formed from the photocurable adhesive composition has been cured by energy beam irradiation, the tensile storage elastic modulus (E') at 25°C is 3.0 × 107 to 2.0 × 109 Pa, the tensile storage elastic modulus (E') at 100°C is 1.0 × 107 Pa or less, and the tensile storage elastic modulus (E') at 260°C is 1.0 × 106 Pa or more.
Inventors:
SATO NOBUYUKI (JP)
YOSHIHARA HIROMI (JP)
YOSHIHARA HIROMI (JP)
Application Number:
PCT/JP2019/000408
Publication Date:
July 18, 2019
Filing Date:
January 09, 2019
Export Citation:
Assignee:
ARISAWA SEISAKUSHO KK (JP)
International Classes:
C09J133/00; C09J7/00; H05K3/34
Foreign References:
| JP2009124135A | 2009-06-04 | |||
| JP2006028400A | 2006-02-02 | |||
| JP2015089926A | 2015-05-11 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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