PHOTOCURABLE COMPOSITION AND ELECTRONIC BOARD

WIPO Patent Application WO/2020/184110

A1

[Problem] To provide a photocurable composition having improved reworkability, and reducing the generation of residue after a cured product is peeled following curing. [Solution] This photocurable composition is a photocurable resin composition containing: a thermoplastic elastomer; a monofunctional aliphatic (meth)acrylic acid ester monomer; a monofunctional alicyclic (meth)acrylic acid ester monomer; a polyfunctional aliphatic (meth)acrylic acid ester monomer; and a radical polymerization initiator, wherein the tanδ peak temperature of a cured product after curing is in a range of -30ºC to 10ºC, the tanδ peak value of the cured product is 0.7 or greater, and the value of tensile elongation at break (%) × tensile stress (MPa) at 100% of elongation is 170 or greater.

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AIZAWA HITOMI (JP)
KEKURA YU (JP)

PCT/JP2020/006562

September 17, 2020

February 19, 2020

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SEKISUI POLYMATECH CO LTD (JP)

C08F2/44; C08F2/46; C08F257/02; C09D4/02; C09D153/02

WO2018143293A1	2018-08-09
WO2018079608A1	2018-05-03

JP2018116958A	2018-07-26
JP2018172460A	2018-11-08
JP2018116959A	2018-07-26
JP2014095041A	2014-05-22
JP2018199796A	2018-12-20
JPS62253609A	1987-11-05
JP2018065897A	2018-04-26
JP2019189775A	2019-10-31
JP2019123786A	2019-07-25

OHTAKE Seigo (JP)

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