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Patent Searching and Data


Title:
PHOTOCURABLE COMPOSITION, THREE-DIMENSIONAL MOLDED ARTICLE, DENTAL PRODUCT, AND SPLINT
Document Type and Number:
WIPO Patent Application WO/2023/189684
Kind Code:
A1
Abstract:
A photocurable composition comprising a photopolymerizable component and a photopolymerization initiator, wherein: when a rectangular test piece A1 having a length of 50 mm, a width of 40 mm, and a thickness of 4.0 mm is produced, the ΔE* ab of the test piece A1 is not more than 6.0; and when a rectangular test piece A2 having a length of 64 mm, a width of 10 mm, and a thickness of 3.3 mm is produced, the test piece A2 has a flexural strength of not less than 50 MPa and a flexural modulus of not less than 1500 MPa.

Inventors:
HAYASHI TAKAAKI (JP)
SAKAMAKI TOSHIKAZU (JP)
KIMURA MAI (JP)
Application Number:
PCT/JP2023/010463
Publication Date:
October 05, 2023
Filing Date:
March 16, 2023
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08F2/48; A61C13/15; A61K6/62; A61K6/74; A61K6/887; B29C64/124; B33Y70/00; B33Y80/00
Domestic Patent References:
WO2019110078A12019-06-13
Foreign References:
JP2021523247A2021-09-02
JP2021504511A2021-02-15
JP2016505525A2016-02-25
JP2015174935A2015-10-05
JP2012226040A2012-11-15
JP2002274896A2002-09-25
JPH08176243A1996-07-09
JP2020046650A2020-03-26
JP2020500986A2020-01-16
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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