PHOTOCURABLE MOISTUREPROOF INSULATING COATING MATERIAL

Title:

PHOTOCURABLE MOISTUREPROOF INSULATING COATING MATERIAL

Document Type and Number:

WIPO Patent Application WO/2011/074504

Kind Code:

A1

Abstract:

Provided is a photocurable moistureproof insulating coating material for printed circuit boards which is reduced in environmental burden and shows excellent surface curability even when irradiated in a small amount and which has high adhesiveness to substrate materials. Also provided are a high-reliability electronic component insulated with the photocurable moistureproof insulating coating material for printed circuit boards and a process for producing the electronic component. A photocurable composition comprising the following components (a) to (c) as essential components is easy to handle and has satisfactory photocurability. A cured object obtained by curing this photocurable composition has excellent adhesion to the substrate and excellent electrical insulation properties. Component (a): a (meth)acryloyl-containing polyurethane obtained by reacting starting materials including a dimer diol, a diisocyanate compound, and a hydroxylated (meth)acryloyl-containing compound as essential ingredients. Component (b): a (meth)acryloyl-containing liquid compound containing neither a urethane bond nor silicon. Component (c): a photopolymerization initiator.

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Inventors:

OOGA KAZUHIKO (JP)
AZUMA RITSUKO (JP)

Application Number:

PCT/JP2010/072300

Publication Date:

June 23, 2011

Filing Date:

December 06, 2010

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)
OOGA KAZUHIKO (JP)
AZUMA RITSUKO (JP)

International Classes:

C09D4/02; C09D5/25; C09D7/12; C09D175/14; H01B3/30; H01L23/29; H01L23/31

Foreign References:

JPH1095640A	1998-04-14
JPH0477514A	1992-03-11
JPH03124719A	1991-05-28
JP2008159437A	2008-07-10
JP2001302946A	2001-10-31
JP2008291114A	2008-12-04
JP2008303362A	2008-12-18

Attorney, Agent or Firm:

AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)

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