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Patent Searching and Data


Title:
PHOTOCURABLE RESIN COMPOSITION FOR ENCAPSULATING AN OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/002183
Kind Code:
A2
Abstract:
The present invention relates to a photocurable resin composition for encapsulating an optical device. The resin composition according to the present invention has excellent chemical resistance, and a high rate of cure to obtain superior adhesion to a panel and thus to effectively block the ingress of gas and moisture into the device, which leads to an elongated lifespan of the optical device. In addition, the resin composition of the present invention can be applied to a dispensing process to simplify the process of sealing the optical device.

Inventors:
SON JUNG-HYUN (KR)
JOO HAN-BOK (KR)
LEE SANG-KYU (KR)
PARK JONG-DAI (KR)
Application Number:
PCT/KR2010/004151
Publication Date:
January 06, 2011
Filing Date:
June 25, 2010
Export Citation:
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Assignee:
DONGJIN SEMICHEM CO LTD (KR)
SON JUNG-HYUN (KR)
JOO HAN-BOK (KR)
LEE SANG-KYU (KR)
PARK JONG-DAI (KR)
International Classes:
C08L33/08; C08K3/00; C08K5/00; H01L33/00
Foreign References:
JP2008140759A2008-06-19
EP2056356A12009-05-06
JP2005183546A2005-07-07
JP2009117308A2009-05-28
EP1548867A12005-06-29
Attorney, Agent or Firm:
WON, YOUNG-HO (KR)
원영호 (KR)
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