Title:
PHOTOCURABLE RESIN COMPOSITION AND LIGHT-EMITTING ELEMENT SEALANT
Document Type and Number:
WIPO Patent Application WO/2011/087101
Kind Code:
A1
Abstract:
Disclosed is a photocurable resin composition that cures quickly, thereby improving productivity, and can provide a light-emitting element sealant that is highly heat-resistant and optically transparent. Also disclosed is a light-emitting element sealant using said photocurable resin composition. The photocurable resin composition contains: (A) 100 mass parts of an end-modified hydrogenated styrene-butadiene rubber; and (B) 0.1 to 13 mass parts of an α-hydroxyalkyl-phenol photopolymerization initiator and/or an acyl phosphine oxide photopolymerization initiator.
Inventors:
KURATA TOSHIHIKO (JP)
OOMORI NAOYUKI (JP)
ATAMI KIYOHIKO (JP)
OOMORI NAOYUKI (JP)
ATAMI KIYOHIKO (JP)
Application Number:
PCT/JP2011/050578
Publication Date:
July 21, 2011
Filing Date:
January 14, 2011
Export Citation:
Assignee:
BRIDGESTONE CORP (JP)
KURATA TOSHIHIKO (JP)
OOMORI NAOYUKI (JP)
ATAMI KIYOHIKO (JP)
KURATA TOSHIHIKO (JP)
OOMORI NAOYUKI (JP)
ATAMI KIYOHIKO (JP)
International Classes:
C08F299/00; C08F2/50; C08F290/04
Domestic Patent References:
| WO1997044363A1 | 1997-11-27 |
Foreign References:
| JP2008195792A | 2008-08-28 | |||
| JP2008291127A | 2008-12-04 | |||
| JP2005129520A | 2005-05-19 | |||
| JP2002156498A | 2002-05-31 |
Other References:
See also references of EP 2524933A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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Claims: