Title:
PHOTOCURABLE RESIN COMPOSITION, PHOTOCURED ARTICLE, AND METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/230947
Kind Code:
A1
Abstract:
Provided is a photocurable resin composition to be used in three-dimensional molding and capable of suppressing a cured section not part of the design from forming on a a molded article surface opposite to the photoirradiated surface of the molded article. The present invention provides a photocurable resin composition which contains a polymerizable organic compound component and a photopolymerization initiator, wherein a cured article with an average thickness of 100μm obtained by curing the photocurable resin composition by irradiation with light having a brightness of 1.7mW/cm2 and an exposure dose of 7.65mJ/cm2 has a light transmittance no higher than 24% at a wavelength of 405nm.
Inventors:
BABA TAKUMI (JP)
YOSHIDA JUN (JP)
DOMOTO TAKASHI (JP)
YOSHIDA JUN (JP)
DOMOTO TAKASHI (JP)
Application Number:
PCT/JP2022/019129
Publication Date:
November 03, 2022
Filing Date:
April 27, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F2/50; B29C64/124; B29C64/264; B33Y10/00; B33Y70/00; C08F2/44; C08F290/06; C08G18/64; C08L101/00
Foreign References:
| JP2019059101A | 2019-04-18 | |||
| JP2015038166A | 2015-02-26 | |||
| JP2019081296A | 2019-05-30 | |||
| JP2017210539A | 2017-11-30 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
Download PDF: