Title:
PHOTOCURABLE RESIN COMPOSITION, AND PRESSURE-SENSITIVE ADHESIVE OR ADHESIVE EACH COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2017/221517
Kind Code:
A1
Abstract:
Provided are: a photocurable resin composition having excellent moist-heat resistance and high heat resistance; and a pressure-sensitive adhesive or an adhesive each comprising the photocurable resin composition.
The photocurable resin composition comprises a polymeric crosslinking agent (A) and a hydroxylated acrylate (B) and may further contain a polymerizable compound (C) as an optional component. The polymeric crosslinking agent (A) is a (meth)acryl-group-terminated polyurethane acrylate which comprises repeating units represented by formula (1a), repeating units represented by formula (1b), and repeating units represented by formula (2). When the total amount of the polymeric crosslinking agent (A), hydroxylated acrylate (B), and polymerizable compound (C) is taken as 100 parts by mass, the photocurable resin composition includes at least 60 parts by mass of the polymeric crosslinking agent (A) and 15-40 parts by mass of the hydroxylated acrylate (B).
Inventors:
TAKIGAWA SHINYA (JP)
IWASA TAKAFUMI (JP)
IWASA TAKAFUMI (JP)
Application Number:
PCT/JP2017/014722
Publication Date:
December 28, 2017
Filing Date:
April 10, 2017
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C08F290/06; C08F2/48; C08G18/67; C09J4/02; C09J175/14
Domestic Patent References:
| WO2015098308A1 | 2015-07-02 |
Foreign References:
| JP2002265885A | 2002-09-18 | |||
| JP2012184383A | 2012-09-27 | |||
| JPH03247618A | 1991-11-05 |
Attorney, Agent or Firm:
NAKAYAMA, Kazutoshi (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
Next Patent: ELASTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR
Next Patent: ELASTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR