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Patent Searching and Data


Title:
PHOTOCURABLE RESIN AND PHOTOCURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2010/117056
Kind Code:
A1
Abstract:
Disclosed is a photocurable resin (A) which has a molecular structure represented by general formula (I). Also disclosed is a carboxyl group-containing photocurable resin (A') which is produced by reacting the photocurable resin (A) with an acid anhydride (d). Further disclosed is a photocurable resin composition which comprises the photocurable resin (A) and/or the carboxyl group-containing photocurable resin (A') and a photopolymerization initiator (B) as the essential components. (In the formula, Ac represents a (meth)acryloyloxy group; R1 represents a residue of an epoxy compound (a), which contains an ethylene group produced by the ring opening of an epoxy group in the compound (a); R2 represents a joint part containing a carbonyloxy group or an urethane bond; n represents an integer of 1 to 99; and m represents 0 or 1.)

Inventors:
CHUJO TAKAYUKI (JP)
OKAMOTO DAICHI (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
MURATA YOSHIAKI (JP)
Application Number:
PCT/JP2010/056444
Publication Date:
October 14, 2010
Filing Date:
April 09, 2010
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
DAINIPPON INK & CHEMICALS (JP)
CHUJO TAKAYUKI (JP)
OKAMOTO DAICHI (JP)
ITO NOBUHITO (JP)
ARIMA MASAO (JP)
MURATA YOSHIAKI (JP)
International Classes:
C08G18/81; C08F290/02; C08F299/02; C08G59/14
Foreign References:
JPH05194877A1993-08-03
JP2002194050A2002-07-10
Attorney, Agent or Firm:
Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)
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